EPS PCB Technologies is a professional and reliable PCB supplier.

  +91 7666303888  Navi MUMBAI MIDC

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Our Facilities

OUR FACILITIES FOR PCB

  • CNC Drilling /Routing Machine.
  • Converse Brushing Machine with Dryer for copper cleaning.
  • Photo Exposing Machine for Pattern Transfer.
  • Screen Exposer Machine.
  • Photo Lamination Dark Room process.
  • Atomies Converse Etching Machine.
  • Plating Line for PTH.
  • Test Equipment for PCB Checking.
  • Dust Free Cabin for Printing.
  • HAL Facility.
  • Bare Board Testing Facility. etc 

PRODUCTION EQUIPMENTS

  • C.N.C. drilling & routing m/c.
  • Semi automatic P.T.H. process line.
  • Panel plating line.
  • Automatic double-side scrubbing & drying m/c. 
    With high pressure rinse.
  • Hot Roll Laminator- Dynachem.
  • Automatic Collimated UV exposure -2kw-5kw.
  • Conveyorised etching – stripping-developing – film stripping m/c.
  • H.A.S.L. Machine.
  • Dimond disc cutting m/c.
  • Bare board testing m/c.-universal tester.
  • Copper thickness measuring instruments.
  • Ph meter for chemical analysis.
  • Line-spacing width measuring glass- 100x.
  • Microscope.

TECHNICAL CAPABILITIES

 

 

NOITEMTECHNICAL DATA
 1.                        TYPES OF LAMINATES                                               FR-4 / FR-2 / CEM-3 / CEM-1
 2.                        TYPES OF PCB                                               1TO 6 LAYERS
 3.                        MAXIMUM BOARD SIZE                                              600 MM-450 MM
 4.                        LAMINATE THICKNESS                                              0.2 MM TO 3.2 MM
 5.                       MAXIMUM FINISH COPPER THICKNESS                                              105 MICRONS
 6.                       COPPER FOIL THICKNESS                                              18 / 35 / 70 MICRONS
 7.                       LINE SPACING                                              0.15 MM( 6 MIL )
 8.                       MINIMUM LINE WIDTH                                              0.15 MM( 6 MIL )
 9.                       MINIMUM SPACING                                              0.15 MM (6 MIL)
 10.                       MINIMUM SPACING                                              0.3 MM
 11.                       MINIMUM PLATING THICKNESS IN HOLE                                              25 MICRONS
 12.                       FLAMMABILITY                                              94V-0
 13.                      SURFACE FINISHES                          HASL, SMOBC, GOLD PLATING, NICKEL PLATING, CONDUCTIVE CARBON

 

NOITEMTECHNICAL DATA
 1.TYPES OF LAMINATES                            FR-4 / FR-2 / CEM-3 / CEM-1
 2.TYPES OF PCB 1TO 6 LAYERS
 3.MAXIMUM BOARD SIZE600 MM-450 MM
 4.LAMINATETHICKNESS0.2 MM TO 3.2 MM
 5.MAXIMUM FINISH COPPER THICKNESS105 MICRONS
 6.COPPER FOIL THICKNESS18 / 35 / 70 MICRONS
 7.LINE SPACING0.15 MM( 6MIL )
 8. MINIMUM LINE WIDTH0.15 MM( 6 MIL )
 9.MINIMUM SPACING0.15 MM (6 MIL)
 10.MINIMUM SPACING0.3 MM
 11.MINIMUM PLATING THICKNESS IN HOLE25 MICRONS
 12.FLAMMABILITY94V-0
 13.SURFACE FINISHESHASL, SMOBC, GOLD PLATING, NICKEL PLATING, CONDUCTIVE CARBON